(1) Main Function : 1. Smashing machine is used for collectioon of wafer bits from the cutting machine . 2.In the wafer line there is wastage from the cutting process which needs to be reused in order to minimize the overall wastage of wafer baking systerm which is about 2% . 3. This equipment is used togrind thediscarded wafer in to reusable form .The ground material can be used with cream as additive depending onthe requirement . 4. The smashing or grinding machine is constructed out of stainless steel material to maintain hygiene of reusable product .The grinding systerm is driven by 3kW motor to have high power and efficiency . (2) Technical Parameter : Main Technical Parameters Dimension : 900x700x900mm 3. Trade Condition Payment TermsT/TLoading PortFOBZhaoqing PortMQO(minmum order quantity )one setDelivery Time30 days (according to the clients 'request )Production Capacity5sets per month